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1、防靜電環氧地坪施工Anti-static Epoxy Self-leveling system抗靜電環氧自流平地面The proposal ：3mm Anti-static Epoxy Self-leveling system方案: 3mm抗靜電環氧自流平地面Sikafloor 239EDF Antistatic epoxy self-leveling system抗靜電環氧自流平系統Approx. 3 mm coating thickness涂裝厚度約 3 mmSikafloor 239EDF is a seamless, self-smoothing, flooring system ba2、sed on advanced solvent-free epoxy system and selected graded fillers. The cured floor exhibits excellent electrostatically dissipative behavior. The smooth, impervious surface can be easily maintained in a hygienic condition.Sikafloor 239EDF 是一種無接縫、自流平環氧系統，它以一種先進的無溶劑環氧樹脂為基料，并采用專門級配的填充料。該地面具有優異的防靜電性3、能，其表面形成光滑的無滲透的地面，易于保持衛生狀態。Performance 性能: Electrostatically dissipative (Resistance to ground 106RG109 Ohm) 防靜電性能(106RG109歐姆) High level of aesthetics and easy to clean 高度美觀，易清洗 Comfort and care 舒適，安全 Smooth and seamless 光滑，無縫Structure Profile 系統結構圖:防靜電面層Anti-static Top-coat導電層Conductive Layer找平層 Le4、vel ayer底漆Primer混凝土ConcreteSystem Description 系統介紹：Step步驟Product & Consumption產品和用量Application Method施工方法Surface Preparation:基層處理Cleaning, grinding and shot blasting清理，研磨和噴砂處理Primer:底漆Sikafloor 161+石英砂 0.3-0.4 kg/m2 Trowel,roller刮板，滾筒Epoxy Leveling mortar環氧找平層Sikafloor 161 0.9 kg/ m2+適量石英砂 0.9kg/m2T5、rowel刮板Conductive Copper Tape導電銅帶Adhibit粘貼Conductive Layer導電層Sikafloor 220W 0.1 kg/m2Roller滾筒Top-coat面層Sikafloor 239EDF 1.8 kg/m2+SikaDur 505 0.6 kg/m2Trowel刮板Material Description材料說明:Sikafloor 161 is a 2 component epoxy resin based, solvent free primer. Sikafloor 161 是一種雙組分環氧樹脂基無溶劑型底油Sikafloor 220W6、 is a two part water dispersed, epoxy resin with high electrostatic conductivity是一種雙組分水性環氧樹脂，具有較高的導電性能。Sikafloor 239EDF is a two part, self-smoothing, coloured epoxy resin coating.Decorative and protective dissipative self-smoothing system for concrete or cement screeds with normal up to medium heav7、y wear.Sikafloor 239EDF 是雙組份的彩色的環氧樹脂，作為一種在混凝土表面和水泥地面導靜電，裝飾和保護的涂層 Sikadur 505Q is a dried fine quartz aggregate, 0.1 -0.3 mm for filling self-leveling floors and as filler in Sikafloor 156/263/264 as leveling mortar or scrape layer.Sikadur 505Q是一種干燥細顆粒骨料，0.1 - 0.3 mm ，用于填充自流平地面及用作Sikafloor161/263/2648、自流平砂漿或刮磨層的膩子層。Thinner DS or Thinner C is a solvent for cleaning purpose.Thinner DS or Thinner C 是用于清潔的溶劑Application Method 施工工藝Inspection Substrate Quality 基面質量檢查The concrete substrate must be sound and of sufficient compressive strength (minimum 25 N/mm2) with a minimum pull off strength of 1.5 N/m9、m2.混凝土基面必須密實和有足夠的抗壓強度（最小25 N/mm2），最小抗拉強度為1.5 N/mm2。Substrate needs to be dry, moisture content 4%. Test method: Sika-Tramex meter or CM - measurement. A waterproofing layer must be installed under the concrete base，or vapor going up will result in epoxy layer bubbling and delamination. 2 mm Sikafloo10、r 81 EpoCem system need to be applied as a moisture barrier.基層須干燥，含水率4%，測試方法：Sika-Tramex儀或CM測量法。混凝土基層下須設置防水層，否則存在水汽上升導致環氧層起泡、脫落風險。建議施工2mm Sikalfoor 81 EpoCem系統作為防潮層。The substrate must be clean and free of all contaminants such as dirt, oil, grease, coatings and surface treatments, etc.基面必須清潔、無任何污染物，11、如：灰塵、油、油脂、涂層和表面處理等。Measure Application Conditions 施工條件測量Substrate Temperature: +10 min. / +30 max.基面溫度：最低+10/最高+30Ambient Temperature +10 min. / +30 max.環境溫度：最低+10/最高+30Relative Air Humidity: 80% R.H. max.相對空氣濕度：最高80%相對濕度Dew Point: The substrate and uncured floor must be at least 3 above dew point t12、o reduce the risk of condensation or blooming on the floor finish.露點：基面和未固化的地面溫度必須至少高于露點3，以防水汽凝結形成斑點。Substrate Preparation 基面處理re-clean the floor surface, degrease agent will be used where necessary.清潔地表，必要時使用清潔劑；Carry out surface preparation by using shot blasting machine (dust free self enclosed s13、teel shot blasting unit) and hand tools to remove surface laitance and to provide sound and textured surface.使用自動無塵噴砂設備和手動工具進行表面預處理，去除混凝土表面翻沫及松散結構，并提供涂裝所需的必要的粗糙度；Remove all remaining dust and debris by dry brushing and vacuum cleaning.掃除殘留的鋼丸及灰塵，并真空吸塵；Repair all floor defects such as honey combs, sc14、ratches, working joints and so on by using SikaDur and Sikaflex range of materials. .使用SikaDur 與Sikaflex等系列產品對地面缺陷如蜂窩麻面、劃痕、施工縫等進行修補；Mixing of material 材料混合:In general, all products must be mechanically mixed using an electrical power stirrer with 300 400 rpm, prior to mixing stir part A mechanically15、. When all of part B has been added to part A, continuously mix for 2 minutes until a uniform mix has been achieved. Depending on the product ad in the filler or C component and mix for another 2 minutes until a uniform mix has been achieved.通常，在機械攪拌A組分之前，所有產品必須用電動攪拌器以300 400 轉速/分機械攪拌。把所有B組分加入A組分之后，16、持續混合2 分鐘直到混合均勻。根據產品加入填料或C組分，繼續攪拌兩分鐘直到混合均勻。To ensure thorough mixing, pour materials into another container and mix again to achieve a consistent mix. Over mixing must be avoided to minimize air entrapment.保證通過混合、傾倒材料進入另一容器后，再次攪拌達到一致混合。需要避免過度攪拌產生氣泡Application of Primer and Leveling layer 底油與找平層施工:App17、lication of Sikafloor 161, consumption approx. 0.4 kg/m for primer；consumption approx. 0.9 kg/m Sikafloor 161 mixed with 0.45kg/m2 quartz sand.Sikafloor 161 用量大約0.4 kg/m；底油固化后，施工環氧砂漿層 ,2.7kg/m2 Sikafloor 161混合2.7kg/m2石英砂.Application of Conductive Copper Tape 導電銅帶施工Placing Earthing Points 設置接地點Applic18、ation of Conductive layer 導電層施工Apply with a layer of Sikafloor 220W, consumption approx. 0.1 kg/m.施工一層Sikafloor 220W， 每層用量大約0.1 kg/m， Checking and Measuring of Resistance 導電層電阻檢測Application of anti-static Top layer 防靜電面層施工After curing of the conductive layer, application of a layer Sikafloor 239EDF 19、with a trowel; consumption approx. 1.8 kg/m Sikafloor 239EDF mixed with 0.6kg/m2 quartz sand.導電層固化后，用刮板施工Sikafloor 239EDF; 1.8kg/m2 混合0.6kg/m2石英砂;Also apply with a spike rolling for deairing and levelling.用齒狀刮刀施工并立即用帶釘的滾筒排氣找平。After application, clean the application tools with Thinner DS.施工結束后用Thinner DS 清洗工具Curing Details 養護細則Temperature 溫度Foot traffic 可步行Light traffic 輕度荷載Full cure 完全固化+1030 hours5 days10 days+2024 hours3 days7 days+3016 hours2 days5 daysNote: Times are approximate and will be affected by changing ambient conditions.備注：以上時間為約值，并會隨周邊環境變化有所改變。