1、防靜電環(huán)氧地坪施工Anti-static Epoxy Self-leveling system抗靜電環(huán)氧自流平地面The proposal :3mm Anti-static Epoxy Self-leveling system方案: 3mm抗靜電環(huán)氧自流平地面Sikafloor 239EDF Antistatic epoxy self-leveling system抗靜電環(huán)氧自流平系統(tǒng)Approx. 3 mm coating thickness涂裝厚度約 3 mmSikafloor 239EDF is a seamless, self-smoothing, flooring system ba
2、sed on advanced solvent-free epoxy system and selected graded fillers. The cured floor exhibits excellent electrostatically dissipative behavior. The smooth, impervious surface can be easily maintained in a hygienic condition.Sikafloor 239EDF 是一種無接縫、自流平環(huán)氧系統(tǒng),它以一種先進(jìn)的無溶劑環(huán)氧樹脂為基料,并采用專門級配的填充料。該地面具有優(yōu)異的防靜電性
3、能,其表面形成光滑的無滲透的地面,易于保持衛(wèi)生狀態(tài)。Performance 性能: Electrostatically dissipative (Resistance to ground 106RG109 Ohm) 防靜電性能(106RG109歐姆) High level of aesthetics and easy to clean 高度美觀,易清洗 Comfort and care 舒適,安全 Smooth and seamless 光滑,無縫Structure Profile 系統(tǒng)結(jié)構(gòu)圖:防靜電面層Anti-static Top-coat導(dǎo)電層Conductive Layer找平層 Le
4、vel ayer底漆Primer混凝土ConcreteSystem Description 系統(tǒng)介紹:Step步驟Product & Consumption產(chǎn)品和用量Application Method施工方法Surface Preparation:基層處理Cleaning, grinding and shot blasting清理,研磨和噴砂處理Primer:底漆Sikafloor 161+石英砂 0.3-0.4 kg/m2 Trowel,roller刮板,滾筒Epoxy Leveling mortar環(huán)氧找平層Sikafloor 161 0.9 kg/ m2+適量石英砂 0.9kg/m2T
5、rowel刮板Conductive Copper Tape導(dǎo)電銅帶Adhibit粘貼Conductive Layer導(dǎo)電層Sikafloor 220W 0.1 kg/m2Roller滾筒Top-coat面層Sikafloor 239EDF 1.8 kg/m2+SikaDur 505 0.6 kg/m2Trowel刮板Material Description材料說明:Sikafloor 161 is a 2 component epoxy resin based, solvent free primer. Sikafloor 161 是一種雙組分環(huán)氧樹脂基無溶劑型底油Sikafloor 220W
6、 is a two part water dispersed, epoxy resin with high electrostatic conductivity是一種雙組分水性環(huán)氧樹脂,具有較高的導(dǎo)電性能。Sikafloor 239EDF is a two part, self-smoothing, coloured epoxy resin coating.Decorative and protective dissipative self-smoothing system for concrete or cement screeds with normal up to medium heav
7、y wear.Sikafloor 239EDF 是雙組份的彩色的環(huán)氧樹脂,作為一種在混凝土表面和水泥地面導(dǎo)靜電,裝飾和保護(hù)的涂層 Sikadur 505Q is a dried fine quartz aggregate, 0.1 -0.3 mm for filling self-leveling floors and as filler in Sikafloor 156/263/264 as leveling mortar or scrape layer.Sikadur 505Q是一種干燥細(xì)顆粒骨料,0.1 - 0.3 mm ,用于填充自流平地面及用作Sikafloor161/263/264
8、自流平砂漿或刮磨層的膩?zhàn)訉印hinner DS or Thinner C is a solvent for cleaning purpose.Thinner DS or Thinner C 是用于清潔的溶劑Application Method 施工工藝Inspection Substrate Quality 基面質(zhì)量檢查The concrete substrate must be sound and of sufficient compressive strength (minimum 25 N/mm2) with a minimum pull off strength of 1.5 N/m
9、m2.混凝土基面必須密實(shí)和有足夠的抗壓強(qiáng)度(最小25 N/mm2),最小抗拉強(qiáng)度為1.5 N/mm2。Substrate needs to be dry, moisture content 4%. Test method: Sika-Tramex meter or CM - measurement. A waterproofing layer must be installed under the concrete base,or vapor going up will result in epoxy layer bubbling and delamination. 2 mm Sikafloo
10、r 81 EpoCem system need to be applied as a moisture barrier.基層須干燥,含水率4%,測試方法:Sika-Tramex儀或CM測量法。混凝土基層下須設(shè)置防水層,否則存在水汽上升導(dǎo)致環(huán)氧層起泡、脫落風(fēng)險(xiǎn)。建議施工2mm Sikalfoor 81 EpoCem系統(tǒng)作為防潮層。The substrate must be clean and free of all contaminants such as dirt, oil, grease, coatings and surface treatments, etc.基面必須清潔、無任何污染物,
11、如:灰塵、油、油脂、涂層和表面處理等。Measure Application Conditions 施工條件測量Substrate Temperature: +10 min. / +30 max.基面溫度:最低+10/最高+30Ambient Temperature +10 min. / +30 max.環(huán)境溫度:最低+10/最高+30Relative Air Humidity: 80% R.H. max.相對空氣濕度:最高80%相對濕度Dew Point: The substrate and uncured floor must be at least 3 above dew point t
12、o reduce the risk of condensation or blooming on the floor finish.露點(diǎn):基面和未固化的地面溫度必須至少高于露點(diǎn)3,以防水汽凝結(jié)形成斑點(diǎn)。Substrate Preparation 基面處理re-clean the floor surface, degrease agent will be used where necessary.清潔地表,必要時(shí)使用清潔劑;Carry out surface preparation by using shot blasting machine (dust free self enclosed s
13、teel shot blasting unit) and hand tools to remove surface laitance and to provide sound and textured surface.使用自動無塵噴砂設(shè)備和手動工具進(jìn)行表面預(yù)處理,去除混凝土表面翻沫及松散結(jié)構(gòu),并提供涂裝所需的必要的粗糙度;Remove all remaining dust and debris by dry brushing and vacuum cleaning.掃除殘留的鋼丸及灰塵,并真空吸塵;Repair all floor defects such as honey combs, sc
14、ratches, working joints and so on by using SikaDur and Sikaflex range of materials. .使用SikaDur 與Sikaflex等系列產(chǎn)品對地面缺陷如蜂窩麻面、劃痕、施工縫等進(jìn)行修補(bǔ);Mixing of material 材料混合:In general, all products must be mechanically mixed using an electrical power stirrer with 300 400 rpm, prior to mixing stir part A mechanically
15、. When all of part B has been added to part A, continuously mix for 2 minutes until a uniform mix has been achieved. Depending on the product ad in the filler or C component and mix for another 2 minutes until a uniform mix has been achieved.通常,在機(jī)械攪拌A組分之前,所有產(chǎn)品必須用電動攪拌器以300 400 轉(zhuǎn)速/分機(jī)械攪拌。把所有B組分加入A組分之后,
16、持續(xù)混合2 分鐘直到混合均勻。根據(jù)產(chǎn)品加入填料或C組分,繼續(xù)攪拌兩分鐘直到混合均勻。To ensure thorough mixing, pour materials into another container and mix again to achieve a consistent mix. Over mixing must be avoided to minimize air entrapment.保證通過混合、傾倒材料進(jìn)入另一容器后,再次攪拌達(dá)到一致混合。需要避免過度攪拌產(chǎn)生氣泡Application of Primer and Leveling layer 底油與找平層施工:App
17、lication of Sikafloor 161, consumption approx. 0.4 kg/m for primer;consumption approx. 0.9 kg/m Sikafloor 161 mixed with 0.45kg/m2 quartz sand.Sikafloor 161 用量大約0.4 kg/m;底油固化后,施工環(huán)氧砂漿層 ,2.7kg/m2 Sikafloor 161混合2.7kg/m2石英砂.Application of Conductive Copper Tape 導(dǎo)電銅帶施工Placing Earthing Points 設(shè)置接地點(diǎn)Applic
18、ation of Conductive layer 導(dǎo)電層施工Apply with a layer of Sikafloor 220W, consumption approx. 0.1 kg/m.施工一層Sikafloor 220W, 每層用量大約0.1 kg/m, Checking and Measuring of Resistance 導(dǎo)電層電阻檢測Application of anti-static Top layer 防靜電面層施工After curing of the conductive layer, application of a layer Sikafloor 239EDF
19、with a trowel; consumption approx. 1.8 kg/m Sikafloor 239EDF mixed with 0.6kg/m2 quartz sand.導(dǎo)電層固化后,用刮板施工Sikafloor 239EDF; 1.8kg/m2 混合0.6kg/m2石英砂;Also apply with a spike rolling for deairing and levelling.用齒狀刮刀施工并立即用帶釘?shù)臐L筒排氣找平。After application, clean the application tools with Thinner DS.施工結(jié)束后用Thinner DS 清洗工具Curing Details 養(yǎng)護(hù)細(xì)則Temperature 溫度Foot traffic 可步行Light traffic 輕度荷載Full cure 完全固化+1030 hours5 days10 days+2024 hours3 days7 days+3016 hours2 days5 daysNote: Times are approximate and will be affected by changing ambient conditions.備注:以上時(shí)間為約值,并會隨周邊環(huán)境變化有所改變。